Job Summary:

We are seeking a Senior/Principal Engineer for CMP Process for our Semiconductor Client in Singapore. In this role, you will own CMP (Chemical Mechanical Planarization) processes and advanced process development for 3D NAND across high‑volume manufacturing; work with cross‑functional teams and suppliers to improve yield, reduce cost and ensure process stability and portability.

• Develop, optimize and sustain CMP processes for yield, cost and reliability improvements
• Troubleshoot manufacturing issues using failure analysis, FMEA, 8D, SPC and FDC methods
• Solve complex CMP Process, Yield and Integration related problems
• Drive yield improvement, cost reduction and risk management initiatives
• Implement and maintain SPC (Statistical Process Control) and FDC (Fault Detection and Classification) systems
• Qualify and deploy new process baselines, tools and materials for NPI and site transfers
• Evaluate equipment, materials and supplier performance to improve process outcomes

This is a full-time position based in Singapore. The employer will handle the Employment Pass (EP) application for successful international candidates.

Requirements:

• Regarded as a specialist in CMP Unit Process and Wafer Fab operations
• MSc/Degree in Chemical Engineering, Mechanical Engineering, Electrical Engineering, Materials Science, Physics or a related field
• Experience with SPC, FDC, RMS or APC systems
• Understanding of structural impacts related to film deposition and CMP within NAND/Memory processes

If this sounds like the role for you, please submit your resume to sewyee.gan@techstaffing.my, stating the job title. We regret that only shortlisted candidates will be notified, but we look forward to connecting if another opportunity arises.